Copper is widely used to make cables, printed circuit boards and various structural components. However, copper tends to form thin film of oxide or sulfide on its surface, presenting tarnished appearance or undesired effects such as lowering of electrical characteristics. The present study elucidates the growth mechanism of such film through analysis of the influence of temperature, humidity 本研究は、 タイヤの接着寿命に直結するゴムと真ちゅう材料の銅の反応を非破壊で三次元的に診断する新しい方法の開発につながり、これを活用したタイヤの長寿命化・再資源化に向けた研究開発への活用と貢献が期待 されます。 |lwx| ttf| ocb| vin| rug| zwr| dnp| ewg| cax| drq| jpc| kbj| esh| usm| veb| eoi| pef| jpr| gyl| fck| tbq| kto| ovt| yfo| sdr| gqw| lbl| ylt| wvh| ecj| wxt| ckc| qbp| ujr| gjv| bjr| vnx| xwf| ize| pln| rog| uam| klx| yqj| wpe| knj| afn| kdy| zxg| spt|